Importance

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Abstract

A system and method for improved thin film deposition is described. One embodiment includes a perimeter mask for thin film deposition, the perimeter mask comprising an at least one mask surface, the at least one mask surface comprising a mask edge, wherein the mask edge is configured to be positioned proximate to a deposition surface; and wherein the at least one mask surface undercuts away from the mask edge. In various embodiments, the perimeter mask may comprise a bezel shape, a parabolic-curve shape, or a segmented curve shape. In some embodiments, the perimeter mask may partially surround a deposition source, such as a heated-pocket deposition source, a PECVD deposition source, or a sputter deposition source. The perimeter mask can assist in achieving more uniform layers of deposition material and improve processing by containing deposition material and reducing cleaning time. In addition, the perimeter mask itself may be heated in order to prevent deposition on the mask itself and further reduce off-time required for cleaning.

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First Claim