Method and System for a Down-hole Cable having a Liquid Bonding Material
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United States of America Patent
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Issued Date -
Oct 20, 2011
app pub date -
Apr 7, 2011
filing date -
Apr 16, 2010
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A system and method for a down-hole cable with a liquid bonding system is provided. Generally, the system contains at least one insulated conductor fully insulated by an insulation coating. An armor shell is positioned exterior to the insulating coating and fully surrounds the insulated conductor. A liquid bonding material is applied between at least a portion of an exterior surface of the insulation coating and at least a portion of an interior surface of the armor shell, wherein the liquid bonding material creates a bond between the insulation coating and the armor shell.
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