EPOXY RESIN COMPOSITION, AND PREPREG AND PRINTED CIRCUIT BOARD USING THE SAME

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United States of America Patent

APP PUB NO 20110253434A1
SERIAL NO

12836983

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Abstract

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Disclosed is an epoxy resin composition for printed circuit board, which includes (A) an epoxy resin; (B) a composite curing agent, including an amino-triazine-novolac resin and dicyandiamide mixed in a certain proportion; (C) a curing accelerator; and (D) an optional inorganic filler.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN UNION TECHNOLOGY CORPORATIONNO 803 PO AI ST ZHUBEI CITY HSINCHU COUNTY TAIWAN R O C

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
CHEN, Hsien-Te Jhubei City, TW 54 134

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