Supporting substrate and method for fabricating the same
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United States of America Patent
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May 28, 2013
Grant Date -
Oct 20, 2011
app pub date -
Aug 10, 2010
filing date -
Apr 20, 2010
priority date (Note) -
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status (Latency Note)
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Abstract
The invention provides a supporting substrate and method for fabricating the same. The supporting substrate includes: a substrate; a first surface metal layer formed on the substrate, wherein the first surface metal layer has a first opening; a second surface metal layer formed on the substrate and disposed oppositely to the first surface metal layer, wherein the substrate has a through hole, and the through hole is formed along the first opening to expose the second surface metal layer; a protective layer formed on the first surface metal layer and the second surface metal layer, wherein the protective layer has a second opening which exposes the through hole; and a conductive bump formed in the through hole, the first opening and the second opening, wherein the conductive bump is electrically connected to the second surface metal layer.
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