Physical Vapour Deposition Processes
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United States of America Patent
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Issued Date -
Oct 27, 2011
app pub date -
May 25, 2009
filing date -
May 27, 2008
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Abandoned
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Abstract
A method of depositing a film of a first material, such as Cadmium Telluride on to a second material, such as Cadmium Sulphide by a physical vapour deposition process wherein said deposition is performed in an atmosphere having a relatively high ambient pressure, in one embodiment between 50 and 200 Torr.
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