Base layer, polishing pad including the same and polishing method
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United States of America Patent
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N/A
Issued Date -
Nov 3, 2011
app pub date -
Aug 13, 2010
filing date -
May 3, 2010
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A polishing pad including a polishing layer and a base layer is provided. Disposed under the polishing layer, the base layer includes a porous inner layer and at least one surface layer. The porous inner layer has an upper surface and a lower surface. The surface layer is disposed on at least one of the upper surface and the lower surface of the porous inner layer. The surface layer has a pore ratio no larger than 0.3%, or is completely non-porous.
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