SYSTEM FOR PLATING A CONDUCTIVE SUBSTRATE, AND A SUBSTRATE HOLDER FOR HOLDING A CONDUCTIVE SUBSTRATE DURING PLATING THEREOF
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United States of America Patent
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Issued Date -
Nov 17, 2011
app pub date -
Nov 14, 2008
filing date -
Nov 14, 2008
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A system for plating a conductive substrate is provided. The system comprises a conductive substrate, comprising a first and a second conductive side, wherein said first side of the conductive substrate is to be plated. Furthermore, the system comprises a substrate holder with an attachment means, for attaching the conductive substrate to the substrate holder, such that a first surface of the substrate holder faces the second side of the conductive substrate. The substrate holder also comprises a resilient contact means, attached to the first surface of the substrate holder, said resilient contact means being connectable to a first external potential. The second side of the conductive substrate is provided with an insulating material exposing the second side of the conductive substrate, such that at least one contact area is provided, wherein the resilient contact means is in contact with the exposed second side in said at least one contact area. A substrate holder therefore is also provided.
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