PRINTED CIRCUIT BOARD, FUEL CELL AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20110281202A1
SERIAL NO

13097155

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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An FPC board, electrode films and a fuel accommodating chamber are accommodated in a casing. In the FPC board, a plurality of collector portions are joined onto a base insulating layer with an adhesive pattern sandwiched therebetween. The base insulating layer is made of porous ePTFE, and is air-permeable. Openings are formed in the collector portions. The adhesive pattern has the same shape as the plurality of collector portions. The FPC board is sandwiched by an upper surface portion and a lower surface portion of the casing while being bent along a bend portion. The electrode films are arranged between the plurality of collector portions of the FPC board. The fuel accommodating chamber is provided between the FPC board and the lower surface portion so as to come in contact with the base insulating layer. A liquid fuel is supplied to the fuel accommodating chamber.

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Patent Owner(s)

Patent OwnerAddress
NITTO DENKO CORPORATIONIBARAKI-SHI OSAKA

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
EBE, Hirofumi Osaka, JP 29 131
HANAZONO, Hiroyuki Osaka, JP 31 124
HASEGAWA, Mineyoshi Osaka, JP 9 37
INOUE, Shinichi Osaka, JP 131 1278
OKUMURA, Keisuke Osaka, JP 31 43

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