EPOXY RESIN COMPOSITION, AND PREPREG AND PRINTED CIRCUIT BOARD USING THE SAME

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United States of America Patent

APP PUB NO 20110284276A1
SERIAL NO

12907521

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Disclosed is an epoxy resin composition for printed circuit board, which includes (A) an epoxy resin; (B) a curing agent; (C) an inorganic filler including manganese oxide; and (D) a curing accelerator.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN UNION TECHNOLOGY CORPORATIONNO 803 PO AI ST ZHUBEI CITY HSINCHU COUNTY TAIWAN R O C

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
CHEN, Hsien Te Hsinchu County, TW 8 18

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