Method for producing wiring board and wiring board
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Aug 20, 2013
Grant Date -
Dec 1, 2011
app pub date -
Aug 7, 2008
filing date -
Aug 8, 2007
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
The present invention provides a wiring board giving good heat dissipation over a long period of use. The present invention also provides a method for producing a wiring board, including coating a surface of a metal substrate, which is made of an aluminum plate, with a composition containing a substance having a polysiloxane structure and inorganic particles having insulating and heat-dissipating properties, curing the composition, then bonding a copper foil to the cured composition, and partially removing the copper foil, thereby forming a wiring layer.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully