Heat radiation component and semiconductor package including same

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8674499
APP PUB NO 20110291258A1
SERIAL NO

13114188

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Abstract

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A heat radiation component configured to be provided through a thermal interface material on a semiconductor device mounted on a board includes a first layer to be positioned on a first side and a second layer stacked on the first layer to be positioned on a second side farther from the semiconductor device than the first side. The coefficient of thermal expansion of the second layer is lower than the coefficient of thermal expansion of the first layer.

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Patent Owner(s)

  • SHINKO ELECTRIC INDUSTRIES CO., LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kitajima, Masakuni Nagano, JP 4 25
Matsuki, Ryuichi Nagano, JP 8 71
Miyajima, Hiroyuki Nagano, JP 17 137
Murayama, Kei Nagano, JP 160 2210
Suganuma, Shigeaki Nagano, JP 60 217

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