INTEGRATED CIRCUIT PACKAGING SYSTEM WITH POSTS AND METHOD OF MANUFACTURE THEREOF
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United States of America Patent
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Issued Date -
Dec 1, 2011
app pub date -
Jun 1, 2010
filing date -
Jun 1, 2010
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a semiconductor wafer having a chip pad; attaching a wafer frame to the semiconductor wafer, the wafer frame having a horizontal cover integral to a protruding connector with the protruding connector on the chip pad; forming an underfill around the protruding connector and between the horizontal cover and the semiconductor wafer; removing the horizontal cover exposing the underfill and the protruding connector; and singulating an integrated circuit package from the semiconductor wafer.
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