LASER PARAMETER ADJUSTMENT
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United States of America Patent
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app pub date -
Feb 12, 2010
filing date -
Feb 13, 2009
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Abandoned
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Abstract
A method is provided for removing a substrate from a component with a laser. The method includes the steps of: applying a laser to a component at different locations with different power or different laser speed levels so as to remove a portion of a substrate from the component and thereby yield a number of markings on the component; measuring the different markings and generating a collection of data associated with different power or speed levels for the laser based on the markings; and adjusting at least one operating parameter of the laser based on the collection of data from the markings. Optionally, the method may be automated.
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