PHOTOSENSITIVE RESIN COMPOSITION
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United States of America Patent
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Issued Date -
Dec 1, 2011
app pub date -
Mar 24, 2011
filing date -
Jun 1, 2010
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A photosensitive resin composition is disclosed. The photosensitive resin composition includes an alkali soluble resin with an epoxy structure, a photopolymerizable compound having an ethylenically unsaturated bond, a photoinitiator, and a thermal curing agent. The photosensitive resin composition provides great surface hardness, adhesion and transmittance to meet industrial requirements.
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