Method for repairing copper diffusion barrier layers on a semiconductor solid substrate and repair kit for implementing this method

United States of America Patent

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Sep 3, 2013
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Dec 1, 2011
app pub date
Sep 7, 2009
filing date
Sep 8, 2008

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Abstract

Method for repairing copper diffusion barrier layers on a semiconductor solid substrate and repair kit for implementing this method.

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Patent Owner	Address
ALCHIMER	FRANCE MASSEY MASSY ESSONNE

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H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....

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Inventor Name	Address	# of filed Patents	Total Citations
Mevellec, Vincent	Chaville, FR	16	60

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Method for repairing copper diffusion barrier layers on a semiconductor solid substrate and repair kit for implementing this method

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United States of America Patent

13003451

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PATENT NO	8524512
APP PUB NO	20110294231A1
SERIAL NO	13003451
DOCKET NO

US Family Size	Non-US Coverage
Patent Longevity Expired	Forward Citations

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
September 03, 2013	US,8524512,B2 US8524512B2	GRANTED PATENT AS SECOND PUBLICATION
December 01, 2011	US,20110294231,A1 US20110294231A1	FIRST PUBLISHED PATENT APPLICATION

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13003451

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