Importance

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Abstract

A semiconductor packaging process with improved die attach method for ultrathin chips package comprises the steps of providing a semiconductor wafer having a wafer frontside and a wafer backside with a plurality of integrated circuit chips (IC chips) formed on the wafer frontside; adhering a supporting substrate onto the wafer frontside through a bonding layer to form a wafer combo; grinding the wafer backside with the supporting substrate and the wafer bonded together; dicing the wafer combo into a plurality of die combos each comprising a substrate piece stacked on top of an IC chip bonded by a bonding layer piece; attaching a die combo onto a die pad of a lead frame with a bottom of the IC chip connected to the lead frame thereof; and removing the substrate piece with the bonding layer piece from the top surface of the IC chip.

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First Claim