INTEGRATED CIRCUIT PACKAGE SYSTEM FOR PACKAGE STACKING AND METHOD OF MANUFACTURE THEREOF
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Dec 15, 2011
app pub date -
Aug 24, 2011
filing date -
Apr 23, 2007
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
An integrated circuit package system and method of manufacture thereof includes: forming an area array substrate; mounting surface conductors on the area array substrate; and molding a molded package body, having a step surrounding a core section, on the area array substrate and the surface conductors, the step providing access to the surface conductors including providing a non-vertical slope from the core section to the step.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully