EASY ADHESION POLYAMIDE FILM AND PRODUCTION METHOD THEREFOR
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United States of America Patent
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Issued Date -
Jan 5, 2012
app pub date -
Mar 24, 2010
filing date -
Mar 25, 2009
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Abstract
Disclosed is an easy adhesion polyamide film including a substrate polyamide film and a primer layer containing an anionic water-dispersible polyurethane resin, formed on at least one side of the substrate polyamide film. The thickness of the primer layer is 0.025 μm or more and 0.250 μm or less. The anionic water-dispersible polyurethane resin has a coating film elongation percentage of 250% or more and a tensile strength of 20 MPa or more. When the easy adhesion polyamide film is subjected to a heat treatment in a helium gas atmosphere at 200° C. for 10 minutes, a total amount of the volatile base components evolved from the easy adhesion polyamide film is 0.50 μg/g or less.
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