Plasma Etching Apparatus

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United States of America Patent

APP PUB NO 20120006490A1
SERIAL NO

13145228

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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the in-plane density of the plasma is equalized, and then the plasma is guided to the substrate K.

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Patent Owner(s)

Patent OwnerAddress
SPP TECHNOLOGIES CO LTDTOKYO 100-0003

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Nozawa, Yoshiyuki Hyogo, JP 7 30
Yamamoto, Takashi Hyogo, JP 951 10608

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