US Patent Application No: 2012/0008,290

Number of patents in Portfolio can not be more than 2000

FLEX-RIGID WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

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Abstract

A flex-rigid wiring board includes a flexible board including a flexible substrate and a conductor pattern formed over the flexible substrate, a non-flexible substrate disposed adjacent to the flexible board, an insulating layer covering the flexible board and the non-flexible substrate and exposing one or more portions of the flexible board, a conductor pattern formed on the insulating layer, and a plating layer connecting the conductor pattern of the flexible board and the conductor pattern on the insulating layer.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
IBIDEN CO., LTD.OGAKI-SHI861

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Aoyama, Masakazu Gifu, JP 58 52
Takahashi, Michimasa Gifu, JP 100 97

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