DIRECT AIR CONTACT LIQUID COOLING SYSTEM HEAT EXCHANGER ASSEMBLY
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Jan 19, 2012
app pub date -
Sep 12, 2011
filing date -
May 15, 2007
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A heat exchanger assembly for use in hybrid liquid-air cooling system adapted to provide a liquid cooling mechanism for components in a personal computer system. The heat exchanger assembly consists of a heat exchanger chamber, though which the thermal transfer liquid flows. An air pump injects air bubbles into the heat exchanger chamber through a porous material. The air bubbles rise up through the thermal transfer liquid and exit at the top of the heat exchanger chamber through a semi-permeable membrane which inhibits loss of the thermal transfer fluid. As the air bubbles pass through the thermal transfer liquid, heat is exchanged directly between the thermal transfer liquid and the contained air. The heat is then removed from the system as the heated air is expelled from the heat exchanger chamber.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully