TEST FIXTURE FOR TESTING SEMICONDUCTOR DIE WITH ITS LOADING MEMBER MAINTAINED FLAT THROUGHOUT THE TEST
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United States of America Patent
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Issued Date -
Jan 19, 2012
app pub date -
Oct 3, 2010
filing date -
Jul 16, 2010
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A test fixture for testing a semiconductor die with its loading member maintained flat throughout the test is disclosed. The test fixture includes a loading member and a frame. The loading member includes a base film having a melting point higher than a thermal equilibrium temperature thereof, wherein the thermal equilibrium temperature is achieved due to heat transfer from the semiconductor die under test to the base film via the adhesive layer. The loading member further includes an adhesive layer made of electrically conductive adhesive material. The loading member is adapted for securing diced LED dies in position and maintained flat throughout the die testing process, thereby ensuring the accuracy of testing for optical and electrical properties of the dies.
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