SEMICONDUCTOR DEVICE
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Jan 26, 2012
app pub date -
Apr 5, 2010
filing date -
Apr 8, 2009
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
This disclosure provides a semiconductor device that can demonstrate an efficient heat releasing effect. The device includes a mount part 11 having a mount surface 6 on which a semiconductor device 3 is mounted, and a reflection part 12 having a reflection surface 7 on which light is reflected around the semiconductor device 3, and a heat releasing part 13 having a first heat releasing surface 8 for releasing heat. The mount part 11, the reflection part 12, and the heat releasing part 13 are integrally formed of metal. Therefore, heat generated in the semiconductor device 3 is promptly conducted to the heat releasing part 13 that is integrally formed with the mount part 11, thereby the heat is effectively released from the first heat releasing surface 8. In addition, heat accumulated in the reflection part 12 by light being irradiated to the reflection surface 7 is also promptly conducted to the heat releasing part 13 that is integrally formed with the reflection part 12, thereby the heat is effectively released from the first heat releasing surface 8.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully