Film for flip chip type semiconductor back surface, dicing tape-integrated film for semiconductor back surface, process for producing semiconductor device, and flip chip type semiconductor device

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United States of America Patent

PATENT NO 9293387
APP PUB NO 20120025400A1
SERIAL NO

13191791

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Abstract

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The present invention relates to a film for flip chip type semiconductor back surface to be formed on a back surface of a semiconductor element flip chip-connected onto an adherend, in which the film for flip chip type semiconductor back surface before thermal curing has, at the thermal curing thereof, a volume contraction ratio within a range of 23° C. to 165° C. of 100 ppm/° C. to 400 ppm/° C.

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Patent Owner(s)

Patent OwnerAddress
NITTO DENKO CORPORATION1-2 SHIMO-HOZUMI 1-CHOME IBARAKI-SHI OSAKA 567-8680

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Asai, Fumiteru Osaka, JP 72 430
Komoto, Yusuke Osaka, JP 10 7
Shiga, Goji Osaka, JP 50 209
Takamoto, Naohide Osaka, JP 91 419

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