LIGHTING MODULE WITH HIGH COLOR RENDING PROPERTY
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United States of America Patent
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Issued Date -
Feb 9, 2012
app pub date -
Aug 9, 2010
filing date -
Aug 9, 2010
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A lighting module with high rending property includes a substrate, a plurality of first light emitting diode (LED) chips, a plurality of second LED chips and a wavelength conversion layer. The first LED chips are deposed on the substrate and electrically connected to the substrate. The second LED chips are deposed on the substrate and electrically connected to the substrate. The wavelength conversion layer seals the first LED chips and the second LED chips. The light emitted from the LED chips and the light emitted from the wavelength conversion layer caused by an excitation by the LED chips are mixing to form warm white light with high color rending property. The number ratio of the first LED chips to the second LED chips deposed on the substrate is 2:1.
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