Side wettable plating for semiconductor chip package
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Feb 4, 2014
Grant Date -
Feb 9, 2012
app pub date -
Jul 25, 2011
filing date -
Aug 9, 2010
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method for providing a semiconductor chip package with side wettable plating includes singulating a semiconductor chip package from an array of packages formed in a block format, immersing the semiconductor chip package in a bath of plating solution, contacting a lead land of the semiconductor chip package with conductive contact material within the bath of plating solution, connecting the conductive contact material to a cathode electrical potential, connecting an anode within the bath of plating solution to an anode electrical potential, and plating the lead land of the semiconductor chip package.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully