HEAT-DISSIPATING STRUCTURE AND LIGHTING MODULE HAVING THE SAME

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United States of America Patent

APP PUB NO 20120038261A1
SERIAL NO

12948939

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A heat-dissipating structure of lighting includes a main body having a plurality of side surfaces; at least one heat pipe connecting to the main body, wherein each heat pipe has a hot end embedded in the main body and a cold end having a contacting surface; and at least one external heat sink mating to the contacting surface. The instant disclosure also provides a lighting module having said heat-dissipating structure.

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Patent Owner(s)

Patent OwnerAddress
KINPO ELECTRONICS INCNEW TAIPEI CITY 22201
CAL-COMP ELECTRONICS & COMMUNICATIONS COMPANY LIMITEDNO 147 SEC 3 BEISHEN RD SHENKENG DIST NEW TAIPEI CITY 22201

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
CHOU, CHIN-WEI TAIPEI COUNTY, TW 17 365
YU, CHENG-HUNG TAIPEI COUNTY, TW 49 413

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