Probe Card for Testing Semiconductor Devices and Vertical Probe Thereof
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United States of America Patent
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Issued Date -
Feb 23, 2012
app pub date -
Aug 23, 2010
filing date -
Aug 23, 2010
priority date (Note) -
Abandoned
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Abstract
A vertical probe for testing semiconductor devices includes a bottom contact and a top contact stacked on the bottom contact in a substantially linear manner. In one embodiment of the present invention, the bottom contact includes a plurality of first wave springs stacked one on top of another in a crest to crest manner, the bottom contact has a bottom opening configured to contact a device under test, and the wave spring is configured to provide a vertical displacement for relieving the stress generated as the vertical probe contacts the device under test, wherein the width of the top contact is greater than the width of the bottom contact.
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