ADHESIVE RESIN COMPOSITION, AND LAMINATE AND FLEXIBLE PRINTED WIRING BOARD USING THE SAME
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United States of America Patent
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N/A
Issued Date -
Mar 1, 2012
app pub date -
Mar 26, 2010
filing date -
Apr 30, 2009
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Provided is an adhesive resin composition containing an epoxy resin and/or a phenoxy resin; an epoxy-containing copolymer obtained by copolymerizing a monomer having an epoxy group and an ethylenically unsaturated monomer that is copolymerizable with the monomer having an epoxy group; a thermoplastic resin; and a curing agent, wherein a copolymer having a weight-average molecular weight of 5,000 to less than 100,000 and a weight per epoxy equivalent of 3,500 g/eq or less is used as the epoxy-containing copolymer. The adhesive resin composition is capable of providing a one-part type adhesive solution that has a good compatibility of the polymer components, that has good flame retardancy and is halogen-free, and that has good storage stability. Also provided are a laminate and a flexible printed wiring board that use the adhesive resin composition.
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