Importance

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Abstract

In a method for continuously coating a wafer for solar cell production, in a coating bath comprising metal such as nickel, copper or silver, said metal is deposited on the wafer. The wafer is introduced into the coating bath and, at a point in time at which the wafer already extends into the coating bath with a first region, but does not extend into it with a second region, a current surge is effected at the second region of the wafer, This initiates the electrodeposition of the metal on the first region of the wafer extending into the coating bath for a subsequent automatic coating with the wafer having been completely introduced into the coating bath, also on the remaining area of said wafer, without a further current surge or current flow.

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First Claim