METHOD AND APPARATUS FOR PRODUCING METAL BOND GRIND STONE

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United States of America Patent

APP PUB NO 20120055100A1
SERIAL NO

13263156

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Abstract

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A metal bond grind stone producing method in which electric power consumption is reduced is provided. In the metal bond grind stone producing method, a sintered metal bond grind stone is obtained by a sintering process of sintering a metal bond grind stone material that is a mixture of a metal binder powder and abrasive grains. In the sintering process, the metal bond grind stone material containing the metal binder powder is heated with microwaves to obtain the sintered metal bond grind stone. The sintering process may be a pressure sintering process of performing microwave heating while pressurizing the metal bond grind stone material.

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Patent Owner(s)

Patent OwnerAddress
KYOTO UNIVERSITYKYOTO CITY KYOTO PREFECTURE JAPAN KYOTO-SHI KYOTO
NISSIN MANUFACTURING CO LTD22 CHITOSE MINEYAMA-CHO KYOTANGO-SHI KYOTO 6270037 ?6270037

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Itoi, Masahiro Kyoto, JP 1 5
Mitani, Tomohiko Kyoto, JP 3 16
Sonobe, Taro Osaka, JP 1 5
Yamazoe, Hiroshi Kyoto, JP 24 501

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