METHOD AND SYSTEM FOR THERMAL TREATMENT OF SUBSTRATES
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United States of America Patent
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Issued Date -
Mar 8, 2012
app pub date -
Feb 28, 2011
filing date -
Mar 1, 2010
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A rapid temperature change (RTC) system includes a bake plate assembly including a heat spreader; a heater substrate coupled to the heat spreader; and a heater layer coupled to the heater substrate. The RTC system also includes a passive chill structure positioned adjacent the bake plate assembly. The passive chill structure is moveable to make physical contact with the heater layer. The passive chill structure includes a chill plate and a thermal pad coupled to the chill plate. The RTC system further includes an active chill structure positioned adjacent the passive chill structure. The passive chill structure is moveable to make physical contact with the active chill structure.
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