MEMS Sensor Package
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United States of America Patent
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N/A
Issued Date -
Mar 8, 2012
app pub date -
Oct 22, 2010
filing date -
Sep 3, 2010
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A MEMS sensor package includes a support and a MEMS sensor chip having a mounting side adhered on the support by a point-shaped adhesive or a linear-shaped adhesive in such a way that the MEMS sensor chip has a free side opposite to the mounting and suspended above the support. Because the MEMS sensor chip has the free side that is not restrained on the support, the stress due to deformation of the support will not affect the accuracy of the MEMS sensor chip.
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