MEMS MICROPHONE PACKAGE
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United States of America Patent
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Issued Date -
Mar 8, 2012
app pub date -
Aug 17, 2011
filing date -
Sep 8, 2010
priority date (Note) -
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Abstract
A microelectromechanical system microphone package has at least one sensitive diaphragm provided in the front side of a microphone component. The microphone component and a cap wafer are connected to one another with their front sides facing one another. The cap wafer functions as an intermediate wafer for installing the microelectromechanical system microphone package. The cap wafer is provided with feedthroughs so that the microphone component is electrically contactable via the cap wafer.
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