Electronic Devices with Protein Layers
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United States of America Patent
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Issued Date -
Mar 8, 2012
app pub date -
Feb 25, 2010
filing date -
Feb 26, 2009
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Abstract
This document describes a method of producing an electronic device comprising biological and electrical materials and an interface between the biological and electrical materials. The method utilizes self-assembly of proteins (11) at a desired location when producing the electronic device. The document also describes electronic devices that include a protein layer as a structural part thereof. The protein layers of the electronic devices containing hydrophobin proteins are also presented. According to some embodiment, the electronic devices also include a layer of graphene (12) in contact with the proteins (11).
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