Thermoelectric modules and assemblies with stress reducing structure
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United States of America Patent
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Issued Date -
Mar 15, 2012
app pub date -
Sep 13, 2011
filing date -
Sep 13, 2010
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Abandoned
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Abstract
A thermoelectric module capable of minimizing thermally and physically induced stress includes a pair of substrates having a plurality of electrically conductive contacts disposed on opposing faces, a plurality of P-type and N-type thermoelectric elements interposed between the pair of substrates forming a thermoelectric element circuit, and one or more of a stress minimizing structural element interposed between the pair of substrates where the stress minimizing structural element has a first surface fixed to one of the pair of substrates and a second surface fixed to the other of the pair of substrates in locations between the pair of substrates that minimize the effects of physical and thermal stresses on the plurality of P-type and N-type thermoelectric elements.
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