COMPLIANT MULTILAYERED THERMALLY-CONDUCTIVE INTERFACE ASSEMBLIES HAVING EMI SHIELDING PROPERTIES
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United States of America Patent
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Issued Date -
Mar 15, 2012
app pub date -
Sep 14, 2010
filing date -
Sep 14, 2010
priority date (Note) -
Abandoned
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Abstract
According to various aspects of the present disclosure, exemplary embodiments are disclosed of EMI shielding, thermally-conductive interface assemblies. In various exemplary embodiments, an EMI shielding, thermally-conductive interface assembly includes a thermal interface material and a sheet of shielding material, such as an electrically-conductive fabric, mesh, foil, etc. The sheet of shielding material may be embedded within the thermal interface material and/or be sandwiched between first and second layers of thermal interface material.
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