Machinable metal/diamond metal matrix composite compound structure and method of making same
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United States of America Patent
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Issued Date -
Mar 15, 2012
app pub date -
Jul 12, 2011
filing date -
Sep 8, 2008
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Abandoned
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Abstract
A high thermal conductivity metal/diamond metal matrix composite made from diamond particles having thin layers of beta-SiC chemically bonded to the surfaces thereof, is utilized in combination with a machinable metal/carbonaceous material metal matrix composite in an integral metal matrix composite compound structure, to provide a machinable high thermal conductivity heat-dissipating substrate for electronic devices.
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