RF layered module using three dimensional vertical wiring and disposing method thereof
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United States of America Patent
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Sep 2, 2014
Grant Date -
Mar 15, 2012
app pub date -
Aug 25, 2011
filing date -
Sep 15, 2010
priority date (Note) -
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Abstract
Provided is a structure and disposing method of a radio frequency (RF) layered module using three dimensional (3D) vertical wiring. A first wafer in the RF layered module having the 3D vertical wiring may include a first RF device and at least one first via-hole. A second wafer may include a second RF device and at least one second via-hole disposed at a location corresponding to the at least one first via-hole. A vertical wiring may connect the at least one first via-hole and the at least one second via-hole. The vertical wiring may be configured to be connected to an external device through a bottom surface of the at least one first via-hole or a top surface of the at least one second via-hole.
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