ELECTRICALLY CONDUCTIVE PASTE COMPOSITION AND ELECTRICALLY CONDUCTIVE FILM FORMED BY USING THE SAME
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United States of America Patent
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Issued Date -
Mar 15, 2012
app pub date -
Mar 2, 2010
filing date -
Mar 6, 2009
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Provided are an electrically conductive paste composition capable of easily and inexpensively forming, on a variety of substrates or in electronic devices, an electrically conductive film such as electrodes and wires excellent in electrical conductivity, surface smoothness properties, and properties of adhesion with a base material; and an electrically conductive film formed by using the above-mentioned electrically conductive paste composition. The electrically conductive paste composition includes flaky aluminum particles as an electrically conductive powder, an average thickness of the flaky aluminum particles is less than or equal to 0.8 μm, and a ratio of an oxygen content to a unit surface area of the flaky aluminum particles is less than or equal to 15 mg/m2.
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