QFN PROCESS FOR STRIP TEST
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United States of America Patent
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Issued Date -
Mar 22, 2012
app pub date -
Nov 25, 2011
filing date -
Nov 5, 2007
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A process for assembling semiconductor devices comprises encapsulating a leadframe matrix having semiconductor die mounted thereon in a mold compound. The leadframe matrix is partially singulated to electrically isolate each individual leadframe unit. A plurality of leadframe units is tested simultaneously. The leadframe matrix is completely singulated. Non compliant units are discarded.
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