HEAT SINK STRUCTURE EMBEDDED WITH HEAT PIPES
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United States of America Patent
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Issued Date -
Mar 22, 2012
app pub date -
Sep 22, 2010
filing date -
Sep 22, 2010
priority date (Note) -
Abandoned
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Abstract
A heat sink structure embedded with a heat pipe includes a heat dissipation seat, at least one heat pipe, a metal-filling adhesive and at least one covering sheet. The heat dissipation seat has a heat absorption surface and a heat dissipation surface. The heat absorption surface has at least one groove to hold the heat pipe and a bonding medium. The groove is covered by the covering sheet. The metal-filling adhesive is filled with the groove to bond the heat pipe and covering sheet through the bonding medium that can increase adhesion force. The covering sheet covers the heat pipe from being damaged during polishing the heat absorption surface to maintain sealing characteristic of the heat pipe. Therefore, the heat pipe can provide rapid heat conduction effect to meet use requirement.
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