Method of forming wafer level mold using glass fiber and wafer structure formed by the same
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United States of America Patent
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Apr 29, 2014
Grant Date -
Mar 29, 2012
app pub date -
Aug 31, 2011
filing date -
Sep 29, 2010
priority date (Note) -
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Abstract
According to example embodiments, a wafer level mold may be formed by a method including attaching a substrate to a lower side of a wafer on which a semiconductor chip is arranged, applying molding liquid to an upper and at least one lateral side of the semiconductor chip and an upper side of the wafer where the semiconductor chip is not arranged, loading a fiber onto the applied liquid, forming a mold layer by compression-molding and curing the liquid loaded with the fiber, and separating the substrate from the wafer.
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