Method of fabricating a polishing pad with an end-point detection region for eddy current end-point detection

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United States of America Patent

PATENT NO 8439994
APP PUB NO 20120079773A1
SERIAL NO

12895529

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Abstract

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Methods of fabricating polishing pads with end-point detection regions for polishing semiconductor substrates using eddy current end-point detection are described.

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Patent Owner(s)

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CMC MATERIALS LLC1209 ORANGE STREET WILMINGTON DE 19801

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Allison, William C Beaverton, US 49 675
Frentzel, Richard Murrieta, US 12 251
Huang, Ping Eden Prairie, US 167 2528
Scott, Diane Portland, US 51 937
Simpson, Alexander William Hillsboro, US 16 219

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