HIGH-POWER FINLESS HEAT DISSIPATION MODULE
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United States of America Patent
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Issued Date -
Apr 5, 2012
app pub date -
Jul 18, 2011
filing date -
Sep 30, 2010
priority date (Note) -
Abandoned
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Abstract
A high-power heat dissipation module for cooling down electronic components comprises a heat exchange element with a sealed cavity, in which a powder sintering portion and a working liquid is provided. The heat exchange element further has a flat section for mounting the electronic component, and a fixing structure. The heat dissipation module further comprises a heat sink with a central hole portion and a heat dissipation structure around the central hole portion. The heat generated by the electronic component is transferred to the heat sink by the heat exchange element, and then quickly dissipated into the air surrounding by the heat dissipation structure. The heat dissipation modules can handle the heat dissipation task for the electronic components with a power of 100 Watts or more is suitable for cooling down high-power electronic components.
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