Homogeneous polishing pad for eddy current end-point detection

United States of America Patent

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Feb 25, 2014
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Apr 5, 2012
app pub date
Sep 30, 2010
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Sep 30, 2010

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Abstract

Homogeneous polishing pads for polishing semiconductor substrates using eddy current end-point detection are described. Methods of fabricating homogeneous polishing pads for polishing semiconductor substrates using eddy current end-point detection are also described.

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Patent Owner	Address
CMC MATERIALS LLC	1209 ORANGE STREET WILMINGTON DE 19801

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B24D:TOOLS FOR GRINDING, BUFFING, OR SHARPENING

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Inventor Name	Address	# of filed Patents	Total Citations
Allison, William C	Beaverton, US	49	675
Frentzel, Richard	Murrieta, US	12	251
Huang, Ping	Eden Prairie, US	167	2528
Scott, Diane	Portland, US	51	937
Simpson, Alexander William	Hillsboro, US	16	219

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Homogeneous polishing pad for eddy current end-point detection

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United States of America Patent

12895479

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PATENT NO	8657653
APP PUB NO	20120083192A1
SERIAL NO	12895479
DOCKET NO

US Family Size	Non-US Coverage
Patent Longevity	Forward Citations

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
February 25, 2014	US,8657653,B2 US8657653B2	GRANTED PATENT AS SECOND PUBLICATION
April 05, 2012	US,20120083192,A1 US20120083192A1	FIRST PUBLISHED PATENT APPLICATION

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12895479

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