HEATER ASSEMBLY AND WAFER PROCESSING APPARATUS USING THE SAME
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United States of America Patent
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N/A
Issued Date -
Apr 12, 2012
app pub date -
Oct 7, 2010
filing date -
Oct 7, 2010
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A heater assembly and a wafer processing apparatus using the same are provided. The heater assembly comprises a substrate, a heater, a reflector and a protective layer. The substrate has a top surface, a side surface surrounding the top surface and a trench formed on the top surface. The heater comprises a heater element accommodated within the trench and two electrodes respectively connecting two ends of the heater element and extending outside of the substrate. The reflector covers an inner surface of the trench. The protective layer covers the top surface, the side surface and the trench.
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