Memory modules including compliant multilayered thermally-conductive interface assemblies
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United States of America Patent
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Sep 16, 2014
Grant Date -
Apr 12, 2012
app pub date -
Dec 19, 2011
filing date -
Jun 17, 2009
priority date (Note) -
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Abstract
According to various aspects of the present disclosure, exemplary embodiments are disclosed of thermally-conductive interface assemblies suitable for use in dissipating heat from one or more components of a memory module. The thermally-conductive interface assembly may generally include a flexible heat-spreading material having first and second sides and one or more perforations extending through the flexible heat-spreading material from the first side to the second side. The flexible heat-spreading material may be sandwiched between first and second layers of soft thermal interface material. A portion of the soft thermal interface material may be disposed within the one or more perforations. The thermally-conductive interface assembly may be positioned relative to one or more components of a memory module to provide a thermally-conductive heat path from the one or more components to the first layer of soft thermal interface material.
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