Method and Apparatus for Improving Substrate Warpage
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Apr 19, 2012
app pub date -
Jul 15, 2011
filing date -
Oct 13, 2010
priority date (Note) -
Published
status (Latency Note)
Importance
Loading Importance Indicators... 
Abstract
A package substrate includes conductive layers and a dielectric interposed between the conductive layers. The dielectric includes a stiffening material component and a neat resin doped with a negative coefficient of thermal expansion (CTE) fiber.
Loading the Abstract Image...
OK
First Claim
Family
Loading Family data...
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully