UV exposure method for reducing residue in de-taping process

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United States of America Patent

PATENT NO 8710458
APP PUB NO 20120091367A1
SERIAL NO

12907711

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Abstract

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A method of forming an integrated circuit includes providing a wafer, and a tape adhered to the wafer, wherein the tape has a main surface perpendicular to a first direction. The tape is exposed to a light to cause the tape to lose adhesion. In the step of exposing the tape, the wafer and the tape are rotated, and/or the light is tilt projected onto the tape, wherein a main projecting direction of the light and the first direction form a tilt angle greater than zero degrees and less than 90 degrees.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTDNO 8 LI-HSIN RD 6 HSINCHU SCIENCE PARK HSINCHU 300-78

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hu, Yu-Hsiang Hsin-Chu, TW 218 792
Liu, Chung-Shi Shin-Chu, TW 824 11367
Lu, Chen-Fa Gangshan Township, TW 23 230

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